(Metallized CeramicProduced byWintrusetk)
Ceramic metallizationndiyo dhizaini yekuisa inonamira zvakanyanya simbi coating pane ceramic surface. Iri inhanho yakakosha sezvo maceramics ari ega asina kunyorova pakutengesa. Iyo metallized layer inovaita solderable, ichipa hwaro hunodiwa hwekugadzira yakasimba ceramic-to-metal kubatana.
Pazasi pane mhedziso yenzira ina dzekutanga dzinoshandiswa muindasitiri nhasi.
1. Molybdenum-Manganese (Mo-Mn)Nzira: Iyo Industrial Standard
TheMo-Mnprocess ndiyo inonyanya kushandiswa uye yakasimbiswa kwazvo ceramic metallization tekinoroji. Kubva pakati pezana ramakore rechimakumi maviri, yanga iri nzira yakajairwa yekugadzira zvisimbiso zvakavimbika muvacuum yemagetsi uye maapplication emuchadenga.
Process Principle:kugadzirira slurry ye refractory molybdenum powder, manganese powder, uye activators (e.g. Al2O3, SiO2, uye CaO) mune organic binder. Iyi slurry inoshandiswa kune ceramic surface uye yakanyungudutswa pakupisa kwakanyanya (1300-1600 ° C) munzvimbo ine hunyoro yehydrogen (dova = +30 ° C).
Zvakanakira: Inopa kusimba kwekuvhara kwepamusoro (kusvika ku60.2±7.7 MPa ine yakabatidzwa nzira) uye yakanakisa vacuum tightness (ine kudonha kwechiyero chakaderera se2.3×10⁻¹¹ Pa·m³/s). Maitiro acho anobvumira akawanda rework cycles uye mabhenefiti kubva kune yakakura, kuregerera maitiro hwindo.
Kuganhurirwa:High sintering tembiricha inogona kuchinja ceramic hunhu. Iyo nzira inoda hombe yehaidhirojeni choto chemidziyo, zvichikonzera nguva yakareba yekutenderera. Uyezve, haienderane neasiri-oxide ceramics seAlN mukusavapo kwe pre-oxidation process.
2. Co-firing Method: Vhura Multilayer Wiring
Iyo co-firing nzira inosanganisira metallization yakananga mune ceramic sintering process. Chinhu chikuru ndecheku "co-firing of green ceramic," iyo inosanganisira skrini-kudhinda simbi inonamira (yakadai se tungsten, molybdenum, kana molybdenum-manganese) pamashizha asina kupiswa (girinhi) ceramic. Aya mashiti anobva asungirirwa uye akabatanidzwa pamwechete kuti apedze ese ari maviri eceramic densification uye yemukati metallization mune imwe nhanho.
3. Direct Bonded Copper (DBC)is Optimized for Power Dissipation
Direct Bonded Copper (DBC)yakagadzirwa muma1970 uye yakatanga kutengeswa neGE muUnited States. Ikozvino yave tekinoroji yakajairwa ye-high-simba IGBT modules uye LED kupisa dissipation substrates. Iyi nzira inosanganisira zvakananga kubatanidza foil yemhangura kune ceramic substrate, zvichiita kuti chigadziro chine high heat conductivity uye magetsi ekudzivirira.
4. Active Metal Brazing (AMB): The One-Nhanho Chisimbiso Revolution
Active Metal Brazing (AMB) chinhu chakakosha innovation chinosanganisa simbi uye brazing kuita imwechete, yakarerutswa maitiro. Izvi zvinoitwa nekuunza zvinhu zvinoshanda, zvakaita seTi, Zr, Nb, kana V, zvakananga kune brazing filler simbi. Pakupisa kwakanyanya, zvinhu izvi zvinopindirana nekemikari nekeramic kuti ibudise dhizaini ine simbi yebhondi. Mienzaniso inosanganisira TiO, TiN, uye Cu3Ti3O. Iyi layer inobvumira iyo brazing filler simbi kunyorovesa iyo ceramic pamusoro zvakananga.
Maitiro maitiro:
Kufambiswa Kwebasa Kwakareruka: Kunobvisa kudiwa kwedanho rekutanga resimbi.
Kudzikira Kugadzira Tembiricha: Kupisa kunoitika kune tembiricha yakadzikira (800–950°C).
Inodzorwa Atmosphere: Ita mune vacuum kana yakakwirira-kuchena inert mamiriro ekudzivirira oxidation yezvinhu zvinoshanda.
Material Versatility: Inokodzera maceramics akadai seAl2O3, AlN, uye Si3N4.
