WINTRUSTEKil on meie klientide jaoks professionaalne ja kirglik meeskond, kes aitab välja mõelda sobivaima lahenduse.
Xiamen Wintrustek Advanced Materials Co., Ltd.
WINTRUSTEK on juhtiv tehnilisele keraamikale spetsialiseerunud tootja alates 2014. aastast. Oleme aastate jooksul pühendunud uurimisele, projekteerimisele, tootmisele ja turustamisele, pakkudes laia valikut täiustatud keraamikalahendusi tööstusharudele, mis nõuavad äärmuslike töötingimuste ületamiseks silmapaistvat materjali jõudlust.
Meie keraamiliste materjalide hulka kuuluvad: - alumiiniumoksiid - tsirkooniumoksiid - berülliumoksiid - alumiiniumnitriid - boornitriid - räninitriid - ränikarbiid - boorkarbiid - Macor. Meie kliendid otsustavad meiega koostööd teha, tuginedes meie juhtivale tehnoloogiale, kutsealale ja pühendumusele tööstusharud, mida me teenindame.Wintrusteki pikaajaline missioon on täiustada täiustatud materjalide jõudlust, keskendudes samal ajal klientide rahulolule, pakkudes kõrgeima kvaliteediga tooteid ja esmaklassilist teenindust.
Choosing between BN and AlN for high-power electronics? Discover the critical differences in thermal conductivity, dielectric properties, and machinability.
Lanthanum hexaboride abbreviated as LaB6 ceramic is a functional ceramic material widely used in electron emission and high vacuum environment. LaB6 is typically chosen for components requiring reliable electron emission and long service life due to its low work function, strong electrical conductivity, high melting point and chemical stability under vacuum.
Boron carbide and silicon carbide are two popular material choices for wear-resistant ceramic nozzles. Both materials exhibit great hardness, good wear resistance and strong chemical stability. However, they vary in hardness, density, resistance to oxidation, resistance to impact, cost of manufacture, and conditions of service. A mix of abrasive type, blasting pressure, operation frequency, nozzle
Aluminum nitride ceramics is not only a high thermal conductivity material in general. It combines thermal conduction, electrical insulation, thermal expansion matching and mechanical stability, resulting in greater heat dissipation, stable operation and long-term durability of the power electronics and semiconductor devices.