Kei a WINTRUSTEK tetahi roopu ngaio me te ngakau nui mo o taatau kaihoko, hei awhina i a koe ki te rapu i te otinga tino pai.
Xiamen Wintrustek Advanced Materials Co., Ltd.
Ko WINTRUSTEK te kaihanga nui i roto i nga taonga hangarau mai i te tau 2014. I roto i nga tau kua whakapau kaha matou ki te rangahau, te hoahoa, te whakaputa me te hokohoko ma te whakarato i te whānuitanga o nga otinga uku mo nga umanga e tono ana i nga mahi tino pai ki te hinga i nga tikanga mahi tino nui.
Kei roto i a maatau taonga:- Aluminium Oxide - Zirconium Oxide - Beryllium Oxide- Aluminum Nitride- Boron Nitride- Silicon Nitride- Silicon Carbide- Boron Carbide- Macor.Ko o taatau kaihoko te whiriwhiri ki te mahi tahi me matou i runga i o maatau hangarau matua, mahi, me te pono ki te nga ahumahi e mahi ana matou.Ko te kaupapa mo te wa roa a Wintrustek ko te whakapai ake i nga mahi o nga rauemi matatau i te wa e mau tonu ana to maatau aro ki te pai o nga kaihoko ma te whakarato i nga hua o te kounga teitei me te ratonga akomanga tuatahi.
Choosing between BN and AlN for high-power electronics? Discover the critical differences in thermal conductivity, dielectric properties, and machinability.
Lanthanum hexaboride abbreviated as LaB6 ceramic is a functional ceramic material widely used in electron emission and high vacuum environment. LaB6 is typically chosen for components requiring reliable electron emission and long service life due to its low work function, strong electrical conductivity, high melting point and chemical stability under vacuum.
Boron carbide and silicon carbide are two popular material choices for wear-resistant ceramic nozzles. Both materials exhibit great hardness, good wear resistance and strong chemical stability. However, they vary in hardness, density, resistance to oxidation, resistance to impact, cost of manufacture, and conditions of service. A mix of abrasive type, blasting pressure, operation frequency, nozzle
Aluminum nitride ceramics is not only a high thermal conductivity material in general. It combines thermal conduction, electrical insulation, thermal expansion matching and mechanical stability, resulting in greater heat dissipation, stable operation and long-term durability of the power electronics and semiconductor devices.