WINTRUSTEK o loʻo i ai se 'au faʻapolofesa ma naunau mo a matou tagata faʻatau, fesoasoani ia te oe e iloa le fofo sili ona talafeagai.
Xiamen Wintrustek Advanced Materials Co., Ltd.
WINTRUSTEK o se taʻutaʻua taʻutaʻua faʻapitoa i sima faʻatekinisi talu mai le 2014. I le tele o tausaga ua matou tuuto atu i le suʻesuʻega, mamanu, gaosiga ma le maketiina e ala i le tuʻuina atu o le tele o faʻataʻitaʻiga sima faʻapitoa mo alamanuia o loʻo talosagaina le faʻatinoina o meafaitino e foia ai tulaga ogaoga o galuega.
O a matou mea sima e aofia ai:- Alumini Oxide - Zirconium Oxide - Beryllium Oxide- Aluminum Nitride- Boron Nitride- Silicon Nitride- Silicon Carbide- Boron Carbide- Macor.O matou tagata faʻatau e filifili e galulue faʻatasi ma i matou e faʻavae i luga o la matou tekonolosi, galuega, ma tautinoga i pisinisi matou te tautuaina.O le misiona umi a Wintrustek o le faʻaleleia lea o le faʻatinoga o mea faʻapitoa aʻo faʻaauau pea la matou taulaiga i le faamalieina o tagata o tausia e ala i le tuʻuina atu o oloa sili ona lelei ma auaunaga muamua.
Choosing between BN and AlN for high-power electronics? Discover the critical differences in thermal conductivity, dielectric properties, and machinability.
Lanthanum hexaboride abbreviated as LaB6 ceramic is a functional ceramic material widely used in electron emission and high vacuum environment. LaB6 is typically chosen for components requiring reliable electron emission and long service life due to its low work function, strong electrical conductivity, high melting point and chemical stability under vacuum.
Boron carbide and silicon carbide are two popular material choices for wear-resistant ceramic nozzles. Both materials exhibit great hardness, good wear resistance and strong chemical stability. However, they vary in hardness, density, resistance to oxidation, resistance to impact, cost of manufacture, and conditions of service. A mix of abrasive type, blasting pressure, operation frequency, nozzle
Aluminum nitride ceramics is not only a high thermal conductivity material in general. It combines thermal conduction, electrical insulation, thermal expansion matching and mechanical stability, resulting in greater heat dissipation, stable operation and long-term durability of the power electronics and semiconductor devices.