WINTRUSTEK dia manana ekipa matihanina sy mafana fo ho an'ny mpanjifanay, manampy anao hamantatra ny vahaolana mety indrindra.
Xiamen Wintrustek Advanced Materials Co., Ltd.
WINTRUSTEK dia mpanamboatra malaza amin'ny seramika ara-teknika hatramin'ny taona 2014. Nandritra ny taona maro dia nanolo-tena tamin'ny fikarohana, ny famolavolana, ny famokarana ary ny varotra izahay tamin'ny fanomezana vahaolana seramika mandroso be dia be ho an'ny indostria izay mangataka fampandehanana ara-materialy miavaka mba handresena ny fepetra miasa mafy.
Ny fitaovana seramika dia ahitana: - Aluminum Oxide - Zirconium Oxide - Beryllium Oxide- Aluminum Nitride- Boron Nitride- Silicon Nitride- Silicon Carbide- Boron Carbide- Macor. ny indostria tompointsika.Ny iraka maharitra an'i Wintrustek dia ny hanatsara ny fahombiazan'ny fitaovana avo lenta raha mitazona ny fifantohantsika amin'ny fahafaham-po amin'ny mpanjifa amin'ny fanomezana ny vokatra avo indrindra sy ny serivisy kilasy voalohany.
Choosing between BN and AlN for high-power electronics? Discover the critical differences in thermal conductivity, dielectric properties, and machinability.
Lanthanum hexaboride abbreviated as LaB6 ceramic is a functional ceramic material widely used in electron emission and high vacuum environment. LaB6 is typically chosen for components requiring reliable electron emission and long service life due to its low work function, strong electrical conductivity, high melting point and chemical stability under vacuum.
Boron carbide and silicon carbide are two popular material choices for wear-resistant ceramic nozzles. Both materials exhibit great hardness, good wear resistance and strong chemical stability. However, they vary in hardness, density, resistance to oxidation, resistance to impact, cost of manufacture, and conditions of service. A mix of abrasive type, blasting pressure, operation frequency, nozzle
Aluminum nitride ceramics is not only a high thermal conductivity material in general. It combines thermal conduction, electrical insulation, thermal expansion matching and mechanical stability, resulting in greater heat dissipation, stable operation and long-term durability of the power electronics and semiconductor devices.