NINAU
  • Hermetic Hybrid IC Packages
  • Hermetic Hybrid IC Packages
  • Hermetic Hybrid IC Packages
  • Hermetic Hybrid IC Packages

Hermetic Hybrid IC Packages

Hermetic Hybrid IC Packages
  • Helium Leak Rate: ≤ 1x10^-13 Pa·m3/s
  • Solder: AgCu, Ag, Au, AuSn, AuNi, AuCu, etc.
  • Plating: Ni/Ag/Au
  • Metal Material: Kovar/SS/OFHC/Pt-Yi/Titanium Alloy/Nickel/Mo, etc.
  • NUI HUA


Ceramic To Metal Brazed Vacuum Feedtrough



undefined


Puke & Hoouna

undefined

Xiamen Wintrustek Advanced Materials Co., Ltd.

HELU:No.987 Huli Hi-Tech Park, Xiamen, Kina 361009
Kelepona:0086 13656035645
Tel:0086-592-5716890


KUAI
leka uila:sales@wintrustek.com
Whatsapp/Wechat:0086 13656035645


E HOEA MAI I KA LEKA
E ʻoluʻolu e leka a e hoʻi mākou iā ʻoe!
NA HUAKAI PILI
Wet diamond polishing pads for granite Ceramic i nā hui brazing malona

Ceramic i nā hui brazing malona

Ceramic i nā hui brazing malona
Wet diamond polishing pads for granite Ceramic To Metal Brazed Vacuum Feedtrough

Ceramic To Metal Brazed Vacuum Feedtrough

Ceramic-to-metal brazed vacuum feedthrough
Wet diamond polishing pads for granite Ceramic Package

Ceramic Package

Ceramic Package
Kuleana kope © Wintrustek / sitemap / XML / Privacy Policy   

Home

HANA

No makou

Hoʻopili