(ʻĀpana i hoʻohui ʻia metalaHana ʻia eWintrustek)
I.Overview of Ceramic-to-Metal Welded Components
ʻO nā ʻāpana welded Ceramic-a-metalahe mau ʻāpana hana pono e hoʻohana ana i nā kaʻina hana wiliwili e hāʻawi i ka ikaika kiʻekiʻe, ka paʻa kinoea kiʻekiʻe, a me nā pilina uila/wela hilinaʻi ma waena o nā mea metala. Hoʻohana maʻamau ʻia lākou i nā noi e pono ai ke kūpaʻa i nā mahana kiʻekiʻe, nā kaomi, a i ʻole nā kūlana vacuum.
II. ʻenehana hoʻopaʻa metala ʻeleu
1. Nā Kuʻuna Kūikawā Nui
Hoʻohana ka hoʻoheheʻe ʻana metala ikaika i nā mea hoʻihoʻi (titanium, zirconium, hafnium, vanadium, a me nā mea ʻē aʻe) i loko o ka mea hoʻopihapiha hoʻopihapiha e hana kemika me nā seramika, e hopena i kahi papa kemika i hoʻopaʻa ʻia ma ka interface ceramic-metal. Loaʻa i kēia mau mea hoʻoikaika i ka oxygen, nitrogen, a me carbon. Hana ʻia ka hoʻomehana ʻana i loko o ka ʻenekini a i ʻole ka lewa inert i nā papa hoʻololi nanoscale (e laʻa, TiO₂, TiN, TiC) ma luna o nā ʻili seramika. ʻAe kēia i ka hoʻoluʻu ʻia e ka mea hoʻoheheʻe hoʻopiha metala, ka hopena i kahi paʻa "ceramic-rection layer-braze joint-metal" hilinaʻi.
2. Nā Kūlana Kaʻina Hana Nui
2.1 Pūnaehana Metala Hoʻopiha Paʻa:
Ag-Cu-Ti: ʻOihana maʻamau, hoʻokō piha maikaʻi loa
Cu-Ti: Ke kumu kūʻai haʻahaʻa, ke kū'ē i ka wela kiʻekiʻe
Au-Ni-Ti: ʻO ka hilinaʻi kiʻekiʻe, nā noi aerospace
Kūʻai Kūʻai ʻole kālā: No nā mea uila e koi ana i ka pale ʻana i ke kālā
2.2 Mana Kaʻina Hana:
Nā Koina Kaiapuni: ʻAha kiʻekiʻe (
Mana Manawa: 20–50°C ma luna o solder liquidus (800–900°C no Ag-Cu-Ti system)
Manawa Manawa: He mau minuke a i iwakālua mau minuke, ke kaulike ʻana i ka piha o ka hopena a me ka mānoanoa o ka papa kuhikuhi
2.3 Kaʻina hana:
Hoʻomaʻamaʻa mua: ʻO ka hoʻomaʻemaʻe pololei ʻana o nā seramika a me ka mālama ʻana i ka metallization; ka wehe ʻana i nā ʻāpana oxide mai nā mea metala
Hui: Hui pololei o nā seramika, nā mea metala, a me ka pepa solder ikaika (0.05-0.2 mm)
Hoʻomaʻamaʻa ʻia: Hoʻokuʻu ʻia → Hoʻomaʻamaʻa papahana → Paʻa ʻana i ka mahana → Hoʻomaʻamaʻa ʻia
Ma hope o ka mālama ʻana: Hoʻomaʻemaʻe a nānā mua
III. Helium Mass Spectrometer Leak Detection Technology
1. Pono o ka ʻike Leak
Hoʻohana ʻia nā ʻāpana welded Ceramic-metal i nā noi kiʻekiʻe e like me nā ʻōnaehana vacuum a me nā lako aerospace. E hōʻoia i ko lākou hoʻokō ʻana i nā pae hoʻohālikelike kokoke-"absolute sealing" (ka leak rate
2. Kumu ʻike
Me ka hoʻohana ʻana i ka helium e like me ke kinoea tracer, hoʻohana pono ke ala i kona nui molekala liʻiliʻi, ʻano inert, a me nā haʻahaʻa haʻahaʻa haʻahaʻa. Hoʻokomo ʻia ka Helium i ka spectrometer nui ma o ka leak, ua hoʻokaʻawale ʻia e kahi māla magnetic, a ʻike ʻia e kahi mea ʻike loea. Ua like ka ikaika o ka hōʻailona me ka helium maʻiʻo, e ʻae ana i nā helu leak rate pololei.
3. Nā ʻano ʻike nui
Hanana 1: ʻO ke ʻano honi (Local Leak Detection)
Kaʻina hana:
Hoʻokuʻu ʻia ka loko o ka mea hana a pili i ka leak detector.
ʻIke ʻia ka wahi weld waho me kahi pū puhi helium.
Nānā ʻia nā hōʻailona i ka manawa maoli e ʻimi pololei i nā wahi leak.
Nā hiʻohiʻona:He kūpono no ka ʻimi ʻana i nā leaks i nā mea liʻiliʻi, ʻike kiʻekiʻe.
Hanana 2:Helium Hood/Enclosure Method
Kaʻina hana:
Hoʻopiha ʻia ka mea hana me ka helium a hoʻokomo ʻia i loko o kahi puʻupuʻu maloʻo, a i ʻole hoʻohana ʻia kahi puʻupuʻu waho/sniffer no ka ʻike.
ʻIke ʻia ka helium i hōʻiliʻili a pakele paha.
Nā hiʻohiʻona:Ana i ka huina leak rate; kūpono no nā mea hana paʻakikī.
4. Ke Kaʻina Hana Hana (E hoʻohana ana i ke ʻano Sniffing ma ke ʻano he Laʻana)
4.1 Māhele Hoʻomākaukau:
ʻO ka hoʻomaʻemaʻe ʻana i nā mea hana, ka hoʻoponopono ʻana i nā mea hana, a me ka hōʻoia ʻana o ka helium kaiapuni.
4.2 Hoʻokō ʻike:
Hoʻopili ʻia ka mea hana i ka ʻōnaehana ʻike leak a hoʻokuʻu ʻia i ke kaomi hana.
Hoʻomaka ka hoʻoheheʻe ʻana i ka Helium i ka wā e piʻi ai ke kaomi ʻōnaehana i ka ≤0.1 Pa (ka mamao o ka pū puhi: 1-2 knm, kaomi: 0.1-0.2 MPa).
Ka nānā ʻana ma ka ʻōnaehana weld, me ka nānā ʻana i nā wahi o ke koʻikoʻi wela.
4.3 Ikepili Ikepili:
Hoʻomaka ʻia kahi puʻupuʻu inā ʻoi aku ka nui o ka leak ma mua o ka paepae (e laʻa, 1×10⁻⁹ Pa·m³/s).
Hōʻailona ʻia nā wahi leak, a hoʻopaʻa ʻia nā kūlana ʻike a me nā ʻikepili.
4.4 Nānā hou a hōʻike:
Hoʻāʻo hou ma hope o ka hoʻoponopono ʻana, a ma hope o ka hana ʻana i kahi hōʻike hoʻāʻo piha.
5. Nā Manaʻo Kūikawā a me nā Kūlana
Hoʻololi Kūikawā Ceramic: E nānā i ka ʻike ʻana i nā wahi microcrack i hoʻokumu ʻia e ka hoʻonui ʻana i ka wela.
Ka Hoʻonaʻauao ʻIke: Koho ʻia ma muli o ke kahua noi; Hiki ke piʻi nā koi aerospace-grade i nā pae e like me ka 10⁻¹² Pa·m³/s.
Hoʻokō maʻamau: Hoʻopili i nā kūlana aupuni/koa, ASTM, a i ʻole nā kikoʻī kikoʻī o ka ʻoihana.
Nānā Haʻole: ʻO ka loiloi microstructural, e like me ka ʻāpana metallographic a me ka scanning electron microscopy (SEM), no nā wahi leak ma mua o nā kūlana.
E hana ʻo Wintrustek i ka hoʻāʻo leak helium no kēlā me kēia seramika i nā ʻāpana metala. E ʻoluʻolu e nānā i ka loulou ma lalo no ka nānā ʻana i kā mākou leak rate test:
https://youtu.be/Et3cTV9yD_U?si=Yl8l7eBH5rON7I_f
IV. Nā hiʻohiʻona noi maʻamau
Hoʻopili uila uila: Ka pilina ma waena o nā substrate seramika (AlN/Al₂O₃) a me nā ʻāpana keleawe i nā modula IGBT.
Nā ʻĀpana Pūnaehana Vacuum: ʻO nā sila ceramic-to-metal i nā mea hoʻoheheʻe a me nā lako semiconductor.
Aerospace: Nā ʻenekini a me nā puka aniani e hoʻopaʻa ai i ka mokulele.
Energy a me Optoelectronics: Hoʻohui pū me nā mea hoʻoheheʻe ahi a me ka pahu laser mana kiʻekiʻe.
V. Hōʻuluʻulu manaʻo
ʻO ka brazing metala ikaika ke ʻano kumu no ka hana ʻana i hilinaʻiseramika-i-metalajunctions, me ka helium mass spectrometer leak detection e lawelawe ana ma ke ano he kumu gula no ka hooiaio ana i ko lakou hermeticity. ʻO ka hui pū ʻana o kēia mau ʻenehana ʻelua e hōʻoiaʻiʻo i ka hilinaʻi lōʻihi o nā mea welded i nā kūlana paʻakikī. I nā noi maoli, he mea koʻikoʻi ka hoʻopaʻa ʻana i nā ʻāpana kaʻina hana brazing a koho i nā ala ʻike leak kūpono a me nā pae sensitivity ma muli o ke ʻano o ka mea hana, nā ʻano waiwai, a me nā pono noi. Hoʻokumu kēia ala i kahi ʻōnaehana hoʻomalu maikaʻi i pani ʻia e holo ana mai ka hana ʻana a i ka hōʻoia.
